LAPLACE-SEMI
Introduction to Laplace (Guangzhou) Semiconductor Technology Co., Ltd.
Laplace (Guangzhou) Semiconductor Technology Co., Ltd., established in December 2021, evolved from the Semiconductor Division of Laplace Renewable Energy Technology Co., Ltd. The company is centered around a team of experienced professionals in semiconductor R&D, manufacturing, components, and equipment, and is dedicated to becoming a leading provider of core process solutions in the semiconductor field.
Currently, the company’s core products include wafer processing equipment such as vertical and horizontal oxidation furnaces, annealing furnaces, LPCVD systems, as well as ceramic substrate brazing furnaces and sintering furnaces. The main application areas focus on the production and manufacturing of semiconductor chips and ceramic substrates.
In its founding year, the company successfully secured and delivered multiple orders for SIC high-temperature activation, oxidation, and LPCVD furnaces. The company places significant emphasis on R&D investment. As of August 2024, the company has filed over 60 patent applications and received more than 30 granted patents. To better meet customer needs, the company officially relocated to the Huangpu Economic Development Zone in Guangzhou in 2023 and established a new production and R&D base in Knowledge City Huangpu District, Guangzhou City covering over 50 acres.
The company adheres to Laplace’s values of “continuous innovation and open collaboration” and is committed to serving a broad range of global customers.
Laplace Group Size:
2016
Company establishment 2016
6
R & D Center
4
Production Sites
3
customer service center
